Prototype and quick turn Printed Circuit Board
24Hours for urgent 1-2layers , 2-4days for multilayer PCBs .
24 hour turnaround time on double-sided PCB’s,
2-4 day turn available up to ten layers;
over ten layers can be done in one week.
To shorten the cycle time of new product introduction,
Major quick service
· Quotes turned in two hours or less on request
· Access to our ERP system to track online orders
· CRM system for customers in need of immediate access
· Multinational, experienced professionals to provide technical
· Door-to-door service with international freight courier services
Chi Tun Electronics believed that in order to be successful we must be an “extension of our customer.be part of the team and take ownership in the time-to-market challenges our customer faces, to develop the products, make them efficient and cost effective through manufacturing , and most of all, the most reliable in the field . we should appreciate the opportunity of showing you how efficiently and cost effective we can supply your needs .
We produce Multilayer printed circuit board, 4layer pcb ,6layer pcb, 8layer circuit board, 10layer circuit board, 12layer pcb,14layer pcb,16layer pcb up to 24layer , HDI printed circuit board ect….
How long I can get the quotation after the RFQ been sent ?
For quick turn, we 100% send back the quotation within 2hr at working day . if urgently PCB projects , please contact us by phone ,online after sent RFQ for fastest action .
What if my design doesn’t meet the specs for the urgently projects?
if your design doesn’t meet these specs for quick trun PCB, we will send the EQ with the quotation files to save your time .
Payment & Shipping Terms:
|Material:||FR4 TG135||Board Thickness:||2.0mm|
|Copper:||1oz||Surface Finish:||Immersion Gold|
2 Layer PCB Board FR4 2.0MM Gold Surface Finish General Purpose PWB Board
. RoHS/ Lead Free
. HDI Microvias
. Blind Vias
. Buried Vias
. Selective Plating
. Impedance Control
. IPC-A-600G Class II
. IPC-A-600G Class III
. PERFAG 2E for Double-Sided Board
. PERFAG 3C for Multilayer Board
Min. Finished Holes Size: 0.008" (0.20mm)
Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)
Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)
Maximum copper thickness: 5oz (140um)
Thin board thickness:
. DS - 0.008 inches (0.20mm)
. 4/L - 0.016 (0.40mm)
. 6/L - 0.020 inches (0.60mm)
Maximum board thickness:
. 275.8mil (7.0mm)
. HASL/lead free HAL/gold plating
. Immersion gold
. Immersion tin
. Immersion silver
. Gold fingers (hard gold)
. Account of layers: Double-side to above 20 layers (1 to 30 layers)
. Max PCB dimensions: 23 X 35 inches (584.2 X 889.0mm)
. Solder mask bridge between solder dam: 4mil (0.10mm)
. Minimum solder mask annular: 1.5mil (0.038mm)
. Min thickness of solder mask: 0.40mil (10um)
. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask
. Min height of Legend: 4mil (0.10mm)
. Min width of front: 25mil (0.635mm)
. Legend colors: White, yellow, black
Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++
Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating
Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.
Contact Person: Mr. Zhang