High Density Interconnect Double Sided PCB With Blind Buried Vias

Double Sided Layer PCB with Blind/Buried Vias for High-Density Interconnect Applications

Quick details:

Base Material: FR4

Copper Thickness: 1 oz

Board Thickness: 1.6 MM

Min. Hole Size: 0.15MM(Mechanical),0.1MM(HDI)

Min. Line Width: 0.075MM

Min. Line Spacing: 0.075MM 3mil/4mil

Surface Finishing: OSP/Gold Finger/LFHASL/ENIG/ENEPIG

Board Size: Customize

Product name: High Frequency PCB

Material: Rogers, Taconic, Arlon, Nelco

Application: Telecommunications, Military and aerospace, Automotive, High-density interconnect

Sheet thickness: 0.1MM-7MM

Maximum board width: Customize

Type: High Frequency PCB

Certificate: ISO9001,

Color: Customize

Package: Vacuum packing or anti-static packing (included humidity card and desiccant)

Description Of Double-sided PCB Printed Circuit Board

Double Sided Layer PCB with Blind/Buried Vias is a highly advanced technology that enables the design of high-density interconnects for compact and miniature electronic devices. This technology allows for the creation of intricate circuitry with components mounted on both sides of the PCB, while still maintaining a low profile and small form factor.

Blind vias and buried vias are drilled into the PCB layers to allow for the routing of signal traces between layers without impacting the outer layers. This technique reduces the amount of surface area required for routing and allows for higher component densities on the PCB. This means that more components can be placed on the same size board, allowing for more functionality in a smaller space.

Double Sided Layer PCB with Blind/Buried Vias are widely used in applications such as smartphones, tablets, wearable devices, and other portable electronic devices. These PCBs are also used in high-speed networking equipment, aerospace, and military applications.

The design of these PCBs requires precision and expertise, as the placement and routing of the vias must be optimized to ensure the highest possible performance. With the use of advanced software and manufacturing techniques, Double Sided Layer PCB with Blind/Buried Vias can be manufactured with a high degree of accuracy and reliability.

Overall, Double Sided Layer PCB with Blind/Buried Vias is an essential technology for the creation of compact and high-density electronic devices with complex circuitry. It allows for the creation of smaller and more powerful devices, making it a vital component in the advancement of technology.

Specification of Omini Double-sided PCB Printed Circuit Board

FAQ:

Q1:Does Omini have enough capacity to prodece high-quality products?

A: Omini has 20 years of history in manufacturing PCB, more than 200 employees and 10,000㎡ factory area.We got the UL, ISO9001 certificates, and our production is sold abroad. We have engouh machines & equipment to ensure the quality, please check our Production Equipment list picturers.

Q2:How long does customers need to wait for the quotation and lead time?

A: We have a prefessional group to deal with your inquiry. In our working time, we will reply to your email within 30 minutes to show we have received your inquiry, Then we will send you our quotation in no more than 6 hours. Please noticed our working time is Monday to Friday, 8am to 24pm.

Q3:How can I make sure my PCB gerber is safety?

A: We promise we won't divulge your gerber to the 3rd party, one of our responsibilities is protecting customer information privacy and security, customer information can be included: company name, address, number, trademark, ect. And we could sign NDA with client if necessary.