CTE is a China based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using 50 micron laser drilled via-in-pad technology and thin build-up materials. Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help.
·Fine pitch down to 0.25mm .Sequential lamination
·Controlled etching capability up to 10layers
·Precise layer to layer registration
Contact Person: Mr. Zhang