Tyler Martin
    The quality of the PCBs I received from this company was outstanding. They were well-made and exceeded my expectations.
    Olivia Anderson
    I've been using this company for all of our company PCB needs for years and I have never been disappointed. Their products are always consistent and reliable, and their prices are very competitive.
    Ashley Williams
    well-packaged and arrived in perfect condition. I would definitely recommend them to anyone in need of high-quality PCBs
Contact Person : Nicole Xu
Phone Number : 0086 18565798250
Whatsapp : +008618565798250

High Performance BGA CPU IC Substrate ASICs CSP PCB

Place of Origin China
Brand Name OminiPCB
Certification ISO9001, UL, TS16949
Model Number 1501
Minimum Order Quantity Negotiate
Price Negotiate
Packaging Details Vacuum packing
Delivery Time 3-8 work days
Payment Terms L/C, T/T, Western Union, MoneyGram
Supply Ability 9,999,999

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Product Details
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BGA CPU IC Substrate




CPU IC Substrate ASICs

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Product Description

High Performance CPU IC Packages Substrate ASICs CSP PCB


Description of IC Substrate PCB Printed Circuit Board

An IC substrate is a substrate used to encapsulate a bare IC (integrated circuit) chip. Connecting chips and circuit boards, IC is an intermediate product with the following functions:

1.  It captures semiconductor IC chips;

2.  Internal wiring connecting chip and PCB;

3.  It protects, strengthens and supports IC chips and provides cooling tunnels.


BGA(ballgridarray), one of the surface mount type packages. A spherical convex spot is made on the back of the printed substrate in the way of display to replace the pins. LSI chips are assembled on the front of the printed substrate, and then sealed with molded resin or potting method. Also known as convex dot display carrier (PAC). Pin can be more than 200, is a multi - pin LSI used a package. The package body can also be made smaller than QFP(four-side pin flat package).


Specification of Omini IC Substrate Printed Circuit Board


IC Substrate Capability Description
System-in-Package Substrate (SIP) System platform that assemble multiple heterogeneous wafers, sensing components, passive componnets.
Plastic Ball Gate Package Substrate (PBGA) The most ball gate array substrate used in wire bonding and packaging.
Flip Chip Chip Scale Package Substrate (FCCSP) The semiconductor chip is interconnected with the substrate by bumps in a flip-chip state.
Flip Chip Ball Array Package Substrate (FCBGA) High-density senmiconductor package substrate that can realize the high-speed and multi-functionalization of LSI chips.



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Q1:Does Omini have enough capacity to prodece high-quality products?

A: Omini has 20 years of history in manufacturing PCB, more than 200 employees and 10,000㎡ factory area.We got the UL, ISO9001 certificates, and our production is sold abroad. We have engouh machines & equipment to ensure the quality, please check our Production Equipment list picturers.

Q2:How long does customers need to wait for the quotation and lead time?

A: We have a prefessional group to deal with your inquiry. In our working time, we will reply to your email within 30 minutes to show we have received your inquiry, Then we will send you our quotation in no more than 6 hours. Please noticed our working time is Monday to Friday, 8am to 24pm.

Q3:How can I make sure my PCB gerber is safety?

A: We promise we won't divulge your gerber to the 3rd party, one of our responsibilities is protecting customer information privacy and security, customer information can be included: company name, address, number, trademark, ect. And we could sign NDA with client if necessary.


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