Rogers RO4730G3 Microwave PCB Printed Circuit Board 2 Layer

Rogers RO4730G3 Microwave Printed Circuit Board

Quick details:

Model:Rogers RO4730 High Frequency Board

Material :Ceramic PTFE Composite Rogers RO4730 D K:3.0±0.05

Layer:2Layers

DielectricsThickness :0.762mm(30mil)

Finished Thickness :0.86mm

Material CoThickness :½(17μm)HH/HH

Finished Co Thickness :1OZ(35μm)

SurfaceTreatment :Immersion Gold

Min Trace / Space:4mil/4mil

Application :PCB antenna,active antenna array for 5g,IOT pcb

Package: Vacuum packing

Product Details

Rogers launched the RO4730G3 UL 94 V-0 antenna level laminate to meet current and future higher performance requirements in active antenna arrays, small base stations, 4G base transceiver, Internet of things devices and emerging 5g wireless system applications.
This flame retardant (UL 94V-0) RO4730G3 thermosetting laminate material is a derivative of Rogers' long trusted and popular circuit material for base station antenna applications. It has a low dielectric constant of 3.0, which is preferred by antenna designers, and a z-direction dielectric constant deviation of ± 0.05 at 10 GHz.
RO4730G3 laminate is made of ceramic hydrocarbon material and low loss LoPro? Copper foil. It can provide excellent passive intermodulation performance (usually better than - 160 DBC), which is very attractive for intermodulation sensitive HF antennas. The Printed Circuit Board material of RO4730G3 is 30% lighter than that of PTFE, and its high glass transition temperature (TG) over + 280 ° C makes it compatible with automatic assembly process. In the temperature range of - 55 degree Celsius to + 288 degree Celsius, the coefficient of thermal expansion (CTE) in Z direction is only 30.3 ppm / C, which is conducive to the reliability of electroplated through-hole structure in multilayer circuit assembly. In addition, the lead-free process resistance of the RO4730G3 laminate material can provide better flexural strength than the ro4000jxr material.
The performance of RO4730G3, a new type of laminate for antenna level circuits, is stable with temperature. The material has a coefficient of thermal expansion (CTE) that matches copper and has a very low rate of thermal change in the Z direction of the dielectric constant over the temperature range from - 50 ° C to + 150 ° C (+ 26
ppm / C at 10 GHz). At the same time, the high frequency loss of RO4730G3 is very low, and its loss factor is 0.0023 at 2.5 GHz and 0.0029 at 10 GHz.
RO4730G3 laminate material provides a practical and cost-effective material solution for current 4G, IOT wireless devices, and active antenna arrays and PCB antennas in future 5g wireless devices. Combined with the right materials, ro4730g3 material can provide the best combination of price, performance and durability.

Specification of Omini Heavy Copper PCB Printed Circuit Board

FAQ:

Q1:Does Omini have enough capacity to prodece high-quality products?

A: Omini has 20 years of history in manufacturing PCB, more than 200 employees and 10,000㎡ factory area.We got the UL, ISO9001 certificates, and our production is sold abroad. We have engouh machines & equipment to ensure the quality, please check our Production Equipment list picturers.

Q2:How long does customers need to wait for the quotation and lead time?

A: We have a prefessional group to deal with your inquiry. In our working time, we will reply to your email within 30 minutes to show we have received your inquiry, Then we will send you our quotation in no more than 6 hours. Please noticed our working time is Monday to Friday, 8am to 24pm.

Q3:How can I make sure my PCB gerber is safety?

A: We promise we won't divulge your gerber to the 3rd party, one of our responsibilities is protecting customer information privacy and security, customer information can be included: company name, address, number, trademark, ect. And we could sign NDA with client if necessary.